SILICON GRINDING WHEEL
Wafer Back Grinder Wheel that adjusts the thickness of wafer to
facilitate chip package for patterned wafer which is pre-fabricated,
a pre-process in the semiconductor manufacturing process.
METAL GRINDING WHEEL
S. Diamond provides LED customers with the optimized products
and technology based on 25 years of accumulated diamond tool
manufacturing technology and semiconductor
Si Back Grinding Wheel development experiences.
VITRIFIED BONDED WHEELS
Precision machining of ferrous and non-ferrous metals, ceramics, carbides, etc.
for automobiles, molds, cutting tools, aircraft, ships, semiconductors
and precision machining parts.