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Silicon Tool

Usage

  • Wafer Back Grinder Wheel that adjusts the thickness of wafer to facilitate chip package for patterned wafer which is pre-fabricated, a pre-process in the semiconductor manufacturing process.

Distinctive Features

  • Si Wafer Damage Relief Design
  • Design to minimize the damage area. Wheel design considering the surface roughness of wafer
  • Gettering effect wheel design

SILICON WHEEL

  • SILICON WHEEL

    ACCRETECH 12 inch

  • SILICON WHEEL

    DISCO 12 inch

  • SILICON WHEEL

    OKAMOTO 12 inch

  • SILICON WHEEL

    8 inch

Workpiece

  • 피삭재

    Si wafer

SEMICONDUCTOR(Silicon Wafer)

What is a Grinder Wheel befitting the semiconductor process?

Wheel design considering roughness

Wheel design considering roughness

S.Diamond makes wheels that meet the requirements of the process and those that the customers need.

Wheel design considering roughness